Infrascope Thermal Stage Options
Sample Heating
- Boosts infrared signal for locating hard to find hot spot defects.
- Reduces the error causing effects of room ambient temperature or other reflected radiation contribution.
- Facilitates automatic software emissivity correction, needed for accurate, easy non-contact microthermal mapping.
- Typically eliminates any need for painting the sample.
- Permits characterizing ICs at various design temperatures .
- Provides a dependable thermal sink for consistent measurements and part safety .
Basic 2 Inch Stage
 |
|
| Surface Area | 2 inch x 2 inch |
| Temperature Range | 15C to +130C |
| Heating/Cooling Method | 1 stage Peltier |
| Heat Sinking Method | Heat Sink to Air |
| Heat Pumping Capacity | 15 Watts @ Ambient, 20W at 100C |
| Control | PID |
Optional Detachable Vacuum Chuck
|
 |
4 Inch Stage
 |
Surface Area | 4 inch x 4 inch |
| Temperature Range | -55C to +165C | |
| Heating/Cooling Method | High Speed 4 stage Peltier | |
| Heat Sinking Method | Recirculating Liquid—Closed Cycle | |
| Heat Pumping Capacity | 200 Watts —Heating and Cooling | |
| Control | PID | |
| Ramp Rate | 100C per minute |
  |
Optional Detachable Vacuum Chuck
Optional Probing Platen.
|
Hot Air Flow Immersion Box
| Ideal for irregular shapes and samples that cannot easily be fastened to a flat thermal stage. Shown here with the emmi 2000 with the Thermal Option. In this Failure Analysis example the application is isolating an ohmic current fault on a decapsulated IC. The IC must be mounted to a PC board for proper operation. In some cases only a small window is exposed. The enclosure incorporates baffles arranged for uniform heating. |  |
|||
 |
|
|
||
